Intel Leads the Way with Advanced Packaging
Sep 6, 2023 · Intel has led the industry in advanced packaging for a couple decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).
Intel Accelerates Process and Packaging Innovations
Jul 26, 2021 · Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery. Continued leadership in advanced 3D packaging innovations with …
Intel Doubles Down on Advanced Chip Packaging - The Motley Fool
Aug 24, 2023 · Intel is set to quadruple its advanced packaging capacity as demand for the technology soars. Chip-giant Intel (INTC -2.90%) is dead set on reclaiming its manufacturing edge over foundry...
Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts ...
Jan 25, 2024 · Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9 is tasked...
Intel opens $3.5 billion advanced Foveros 3D chip packaging …
Jan 24, 2024 · On Wednesday, Intel announced that Fab 9 had begun operations at its Rio Rancho site in New Mexico. The $3.5 billion production facility was built to package chips using Foveros 3D technology and...
Intel Leads the Way with Advanced Packaging - Tech Times
Sep 8, 2023 · Intel has led the industry in advanced packaging for a couple decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips...
Intel is delivering several advanced logic, packaging, and systems capabilities as part of its new systems foundry for the AI era. These technologies enable pioneering new approaches for customers to develop architectures, products, and high-performance, efficient systems to support demanding applications like AI.
Intel’s Next Generation Packaging: EMIB and Foveros
Jul 26, 2021 · Intel’s two main specialist packaging technologies are EMIB and Foveros. Intel explained the future of both in relation to its future node development. EMIB: Embedded Multi-Die Interconnect...
Intel Bets on Advanced Packaging to Help Put It Back on Top
Aug 20, 2021 · Intel revealed more of its advanced packaging playbook at its Intel Accelerated event last month and introduced two new 3D chip stacking technologies—Foveros Direct and Foveros Omni—both of...
Inside Intel's CPU Packaging Factory: From Wafer to Chip
Sep 18, 2023 · Intel and TSMC are competing furiously to provide the most advanced packaging technologies available, and Intel's Malaysia facilities play a key role in its efforts as it looks to ramp up...