FOUP (an acronym for Front Opening Unified Pod[1] or Front Opening Universal Pod[2]) is a specialized plastic carrier designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or …

Jun 7, 2021 · Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. Industry-proven door provides equipment interoperability and long life

Aug 17, 2023 · To increase throughput and efficiency, factories use FOUP handlers to move wafers safely from one manufacturing step to the next. If you’re curious about what FOUPs are and how they work, read on! We’ll answer all your questions and more. What Is FOUP? What Are FOSB and FOUP? What Is A FOUP Load Port? What Is FOUP?

A wafer FOUP is a specialized container designed to safely transport 300mm silicon wafers within automated material handling systems (AMHS). FOUP is specifically designed to accommodate 300mm wafers, which have become the standard in modern semiconductor manufacturing.

Jun 7, 2021 · Front opening unified pod (FOUP) platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. 25- or 13-capacity FOUPs are available for thin, standard, and thick wafer substrates

Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated process steps.

It can protect, transport, and store 12 inch wafers. Shin-Etsu Polymer protects processed wafers at factories, provides safety protection and effectively reduces the risk of wafers being polluted by micro-particle. Accurate dimensions specified in SEMI standard.

The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and low cost of ownership for your facility.

Wafers are moved around fabrication facilities in specialized sealed plastic boxes known as FOUPs. These have an internal nitrogen atmosphere that keeps copper from oxidizing on the wafers. Modern semiconductors use copper for their wiring. In fact, the cleanroom's internal air is kept cleaner than the processing machinery and FOUPs.

The F300 AutoPodTM wafer carrier is a 25-capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and the highest overall output for your facility