Anodic bonding is a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer. Anodic bonding is commonly used to seal glass to silicon wafers in electronics and microfluidics.

Anodic Bonding: a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer; it is commonly used to seal glass to silicon wafers in electronics and microfluidics.

Oct 14, 2014 · Initially reported for joining a metal surface to a glass surface, the term “anodic bonding” is used today mainly to identify the bonding of silicon wafers to glass wafers with high content of alkali oxides (fig. 2).

The anodic bonding behavior of surface layers is predictable. Oxidizable surface can well be bonded, inert ones just difficult or even not at all. Deep understanding of Anodic Bonding helps to use its in new applications, like anodic bonding of both sides of glass wafers.

Dec 4, 2022 · 1.1 This document provides operating procedures for four inch anodic wafer bonding with the EVG 520. 2. Table of Contents. 3. Reference Documents. 4. Equipment and/or Materials. 5. Safety. 5.1 Follow all Nanofab safety procedures. 5.2 Chuck will be hot after bonding. Use the bond chuck removal tool to move the chuck.

Apr 23, 2020 · Anodic wafer bonding is used to join silicon and glass wafer together. It is frequently used at the end of process for wafer level packaging. More recent developments have moved the anodic bonding process to earlier in the MEM's fabrication where one …

Oct 14, 2014 · Set Voltage: enables or disables anodic bonding with specified polarity, voltage set point and current set points. Wait Charge : The bond system is accumulating the charge created during the time when voltage is applied.

Anodic bonding, also referred to as field assisted glass-silicon sealing, is a process of bonding a silicon wafer to glass under the influence of high temperature and an externally applied electric field.

Anodic bonding is a technique to produce hermetic seals between metals and glass insulators. Anodic bonding is mostly used for hermetic sealing of silicon and glass. Different from other sealing techniques, anodic bonding involves heating …

Jan 1, 2015 · Anodic bonding is a highly successful wafer bonding technique used in a large number of industrial products and it is also offered as part of industrial foundry services. It is by its physical and chemical nature a method with a high potential resulting in …