ROHM has developed new 4-in-1 and 6-in-1 SiC molded power modules in the HSDIP20 package, optimized for PFC and LLC converters in onboard chargers (OBCs) for electric vehicles (xEVs). The lineup ...

AMI has announced that it is bringing its expertise in industry-leading silicon firmware solutions to the Arm Total Design ecosystem, aimed at accelerating development of custom silicon on Arm Compute ...

This product achieves an industry-leading optical output power of 1.7 W at a wavelength of 420 nm, close to the g-line of mercury lamps, in a compact TO-56 CAN package. Using this high-output, compact ...

1.22 billion smartphones shipped globally in 2024, Apple, Samsung and Xiaomi lead Date: 17/01/2025 Canalys reported that the global smartphone market grew by 3% to reach 330 million units in Q4 2024, ...

STMicroelectronics announced a new microcontroller series with improved embedded artificial intelligence (AI) capability by integrating, for the first time, accelerated machine-learning (ML) ...

Samsung held a tool-in ceremony for its new semiconductor research and development complex (NRD-K) at its Giheung campus, marking a significant leap into the future. About 100 guests, including those ...

Nexperia introduced a new series of high-performance gate driver ICs designed for driving both high-side and low-side N-channel MOSFETs in a synchronous buck or half-bridge configuration. These ...

Yole said back-end semiconductor equipment market faces short-term decline but anticipates recovery with adoption of advanced packaging techniques, where it outlines below points: The back-end ...

Navitas Semiconductor has announced GaNSlim, a new generation of highly-integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density ...

Samsung starts mass production of its 1Tb QLC V-NAND Date: 20/09/2024 Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

Navitas Semiconductor announced the release of a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages. Navitas’ ...