Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, ...

IoT analyst firm Berg Insight reported that the global market for precision agriculture solutions is forecasted to grow from € 5.5 billion in 2023 at a compound annual growth rate (CAGR) of 11.6 ...

Ambarella unveiled N1-655 edge GenAI system-on-chip (SoC), which provides on-chip decode of 12x simultaneous 1080p30 video streams, while concurrently processing that video and running a hybrid of ...

Elmos Semiconductor and ID Quantique have signed a Memorandum of Understanding (MoU) as a basis for their strategic collaboration to develop the world's smallest monolithically integrated Quantum ...

Lam Research announced introduction of cobot named Dextro, designed to optimize critical maintenance tasks on semiconductor wafer fabrication equipment. Now deployed in multiple advanced wafer fabs ...

Omdia predicts rapid growth in demand for Google’s Tensor Processing Unit (TPU) AI chips, a trend that may be strong enough to start chipping away at NVIDIA’s market dominance in GPUs. 3Q results from ...

Semtech shared a key milestone in 5G RedCap (reduced capacity) rollout. The company’s EM8695 5G RedCap module, powered by the Snapdragon X35 5G Modem-RF System, has earned FCC and PTCRB certifications ...

BrainChip announced its integration into an innovative technology offering that leverages the Akida processor to provide cybersecurity protection for WiFi access, home router, small enterprise routers ...

Vertical Compute, founded by CEO Sylvain Dubois (ex-Google) and CTO Sebastien Couet (ex-imec), announced that it successfully closed a seed investment round of €20 million. The round was led by ...

Taiwan based Alchip announced opening of its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) ...

Researchers Rajeev Ranjan and Gobinda Das Adhikary at Indian Institute of Science (IISc) able to reduce the thickness of piezoceramics by preventing atomic defects inadvertently formed during ...

sureCore and Sarcina have teamed up to develop custom BGA package specially for cryogenic temperatures and any such trending packages for semiconductor chips working in the cryogenic temperature range ...