Huawei has been under constant pressure from external countries due to the technology trade war that has been ongoing for the ...
Danisense, a Denmark-based provider of high-accuracy current sense transducers for demanding applications, has recently ...
• Scene arrival: The new search mode is a valuable tactical addition that helps crews to locate fire and detect lower temperatures during scene size-up. With colorization from 80° C to 200° C (175° F ...
Encoder Products Company (EPC), a U.S.-based designer and manufacturer of motion feedback devices, announces the launch of the LP1 Accu-LaserPro, a breakthrough non-contact encoder designed for ...
During The Things Conference 2025, Morse Micro unveiled its second-generation Wi-Fi HaLow system-on-chip (SoC) that will ...
Altech Corporation announces the immediate availability of its full range of Eurostrips terminal strips. These economical and ...
In July, the U.S. made a deal with China that saw electronic design automation (EDA) tools opened again for Chinese firms to purchase and use in exchange for certain rare Earth elements. This ...
Qorvo has launched a Ku-band beamforming chip targeted at terminals that support time-division duplexing (TDD) in satellite communication (SATCOM) applications.
Electronic warfare (EW) is becoming increasingly important in a variety of war theaters. Everything from satellites to submarines has sensors these days, and the more advanced systems still need to ...
Verizon has launched the Verizon 6G Innovation Forum, a new initiative that will unite vendors in the telecommunications ecosystem to develop early 6G use cases, devices and networking technology.
Both transceivers follow Semtech’s introduction of its first LoRa Plus devices for Gen 4 back in March of 2025 called the LR2021. The device is capable of 2.6 Mbps and is compatible with LoRa, LoRaWAN ...
Designed for high-performance data acquisition in compact, space-constrained environments, the ADQ3-USB brings the full capabilities of the ADQ3 platform into a stand-alone USB 3.2 form factor ...