The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers.

Flash Memory Summit 2023, or FMS23, brought together developers large and small of chips, software, SSDs, storage systems and related products to show their latest wares and claim their stake in ...

Part of Kioxia's LC9 series of enterprise SSDs, the new drive offers 245.76TB of capacity by stacking 32 2Tb QLC 3D flash ...

KIOXIA is sampling 9th Gen BiCS FLASH devices with 512Gb TLC memory technology designed for high-performance and power ...

By earning a spot on Ethisphere’s 2025 list of the World’s Most Ethical Companies and attracting significant hedge fund ...

Octal flash memory. Octal flash memory, or octal data transfer interface, utilizes eight data lines for input and output operations, resulting in significantly higher data transfer rates compared to ...

Cadence Memory Model Portfolio supports all the listed flash memory interfaces with comprehensive timing and protocol checks to catch design bugs. Hundreds of predefined configurations based on ...

Largest local consumer electronics maker, and among OC’s largest private companies by sales. Maker of flash memory products ...

3D flash memory employs a different cell architecture than 2D floating gate that improves reliability and performance. 2D floating-gate memory utilizes a trench cell architecture, whereas 3D flash ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface.

Like flash, FRAM has limited memory rewrite cycles. Today, Ramtron and Symetrix produce FRAM memory chips. Ramtron delivers 256-kbit chips, which are 3.3- and 5.0-V devices.