Release Summary Rudolph and DISCO partner to optimize the wafer saw process through post-saw inspection, real-time monitoring and feedback of dicing tools and wafer-to-process tool correlations.

Singulus Technologies, the German-headquartered machinery and tooling supplier to the solar industry, has developed a new process that integrates diamond wire sawing into the company’s LINEX ...

Austin, July 26, 2024 (GLOBE NEWSWIRE) -- The Wafer Process Control Equipment Market Size was valued at USD 7.93 billion in 2023 and is estimated to reach USD 14.06 billion by 2032 and grow at a ...

The German production manufacturer has announced the development of a new process for the texturing of diamond wire cut multi silicon wafers. Schmid says that it will ship the first systems ...

TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was expected that world's largest contract maker of chips will charge ...