Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

The new WaferWeight measurements may have a resolution as low as 0.1mg. This allows precise tracking of changes in wafer mass between process steps – and also between different wafers in a lot.

Certain non-killer but marginal wafer defects can escape detection if they have sufficient electrical connectivity.

Industry research firm Mordor Intelligence estimates that the wafer cleaning equipment market size is US$9.10 billion in 2024, and is expected to reach US$13.57 billion by 2029, growing at a ...

ACM Research's new SPM tool enhances wafer processing efficiency and cleanliness, gaining qualification from a key Chinese semiconductor manufacturer. ACM Research, Inc. announced that its Single ...

FREMONT, Calif., July 24, 2025 (GLOBE NEWSWIRE) -- (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today ...

Laser Photonics Propels R&D Efforts in Wafer Marking Delivering Advanced Equipment to Support the Growth of U.S. Chip Manufacturing February 04, 2025 07:25 AM Eastern Standard Time ...

To learn more about ClassOne Technology’s wet processing platforms, visit us in booth #1453 at SEMICON West in San Francisco, July 9-11, 2024.To schedule a demo, click here.

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources.