Engineers and researchers who work with diamond for quantum sensors, power electronics or thermal management technologies ...

Diamond is one of the most prized materials in advanced technologies due to its unmatched hardness, ability to conduct heat and capacity to host ...

In the field of semiconductor equipment manufacturing, various industrial ceramics are widely used due to their special ...

Fraunhofer ISE researchers say their newly fabricated gallium arsenide substrates (InP-on-GaAs wafers) can replace prime ...

The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Home > Press release: This is how the optics of the future are ...

CMP is the polishing or flattening of a semiconductor wafer surface to remove excess material so that additional layers can be added. Conventional CMP uses a chemical and an abrasive slurry to ...

Dublin, March 20, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Polishing & Grinding Equipment Market by Equipment Type (Grinding Equipment, Polishing Equipment), Wafer Size (200 mm Wafers ...

These include a symphony of techniques involving both wet and dry etching at the wafer edge, chemical mechanical polishing (CMP), edge deposition, and edge trimming steps. The improvement in ...

With EVs and efficient power converters becoming more prevalent, the demand for high-quality SIC wafer polishing is set to rise, fueling market growth and innovation. CMP And Polishing Pads Are ...

The California Energy Commission project report details the use of wafer polishing and metrology tools provided by Axus Technologies and KLA Corporation respectively, but, again, no details of the ...