The chucks developed and manufactured by Berliner Glas already have been made as resistant as possible to particle contamination by using a special pin or mesa design. The contact area between the ...

With these modes, the AC3 Fusion thermal chuck system is a no-compromise solution for energy-efficient and flexible tri-temperature wafer test. ERS's AC3 with patented air-management technology ...

To supply signals and power to the DUT, a metal-to-metal contact needs to be made between the DUTs pads/pin and interface hardware. For wafer test (sort or probe), this interface hardware is called a ...

Enables adsorptive immobilization with a high extraction rate without deforming thin, sub-50μm semiconductor wafer or film Makes ... called the Hot Vacuum Chuck, or HoVaC for short.

ERS's new "High Power Dissipation" System can dissipate wattage up to 2.5kW at -40°C on a 300 mm chuck, thereby allowing the testing of single dies as well as tests with full wafer contact.