N.C.), introduced an “engineered substrate” material last week for use in surface-acoustic-wave (SAW) filters. But the new material is just the beginning for the company. Ziptronix sees its ...

The wave guides need a much higher level of control of the silicon ... These include <100nm alignment accuracy, new levels of cleanliness in chip-to-wafer bonding and singulation tools, exceptional ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...

This assumption gets tossed out of the window when it comes to optical contact bonding, which is a process ... Surface roughnesses of a SiO2 wafer (left, ≈1.01 nm RMS) and an ULE wafer (right ...

Pure Wafer, a San Jose-based semiconductor supplier, is planning to triple capacity of its production site in Prescott after closing a private equity deal. Here's what we know. Semiconductor ...

Jan. 23, 2025 /CNW/ -- Ortel, a Photonics Foundries enterprise, today announced the successful transfer of wafer fabrication for its C-Band, High-Power, Continuous Wave Laser Module platform to ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...