The Global Silicon Photonics Market, valued at USD 1.64 billion in 2023, is set to surge to USD 12.94 billion by 2030, expanding at an exceptional CAGR of 25.8%. By monolithically integrating photonic ...

SOI wafers incorporate an ultra-thin layer of silicon separated from the bulk substrate by an insulator (typically silicon dioxide), dramatically reducing parasitic capacitance and improving thermal ...

In an era demanding ever-smaller, more efficient, and higher-performing light sources, particularly in the short-wave ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS ...

The cases are the latest test of the president’s expansive claims of executive power. By Tony Romm Reporting from Washington Somewhere along a roughly 7,500-mile journey that begins in Shenzhen ...

Achieving room-temperature, continuous-wave operation with electrical injection is a ... transfer-printing hybrid techniques in the near term, over heterogeneous wafer- and die-bonding technologies ...

Achieving room-temperature continuous-wave lasing with threshold currents as low as 5 ... micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive ...