N.C.), introduced an “engineered substrate” material last week for use in surface-acoustic-wave (SAW) filters. But the new material is just the beginning for the company. Ziptronix sees its ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

Imec, Brewer Science, and Suss MicroTec recently demonstrated that collective die-to-wafer bonding flows can be extended to three and four wafers. [1] A so-called acoustic layer was added to the ...

The wave guides need a much higher level of control of the silicon ... These include <100nm alignment accuracy, new levels of cleanliness in chip-to-wafer bonding and singulation tools, exceptional ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...