Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

Adeia Inc., a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded ...

CEA-Leti has developed an innovative superconducting interconnect brick that could enable achieving a higher density of ...

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

However, hybrid bonding always joins both metal and dielectric films with no intermediate film. Imec demonstrated state-of-the-art hybrid bonding at IEDM last year with 700nm pitch copper hybrid ...

The companies said it is a logical next step for them, as they have been working on development of modular equipment design for plasma-activated wafer bonding since 1998. Now that EVG has licensed ...

The EVG501 wafer bonding system can handle small substrate pieces up to 200-mm wafers, and supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder and ...

Packaging MEMS devices is a very challenging task that poses problems distinct from conventional ICs. Among the complexities is the need for protection from particulate contamination, moisture ...

3M Opens Temporary Wafer Bonding Application Lab in Taiwan to Provide Support for 3D Integrated Circuits and Ultra-Thin Wafer Handling for the Semicon ...