This paper establishes a packaging module of multichip with lead-free solder ball SAC305. BGA solder ball adopt nonlinear Anand viscoplasticity constitute formula. With the change factor of five screw ...

Automatic segmentation of BGA bubbles is of great significance for industrial defect detection. In recent years, convolutional neural network (CNN) has achieved good performance in the field of image ...

Apple planning Vision Pro successor with M4 chip, AI features: Here's when it could launch The upcoming version will retain the same core design but introduce a faster M4 chip and an improved ...

Samsung Electronics anticipates a 39% drop in Q2 profit, primarily due to weaker-than-expected AI chip sales. More details here.

Apple is set to launch an upgraded Vision Pro headset with a focus on improved chip performance and user comfort.

With a blend of speed and low power use, KIOXIA UFS Ver. 4.1 devices are built to enhance user experiences - enabling faster downloads and smoother app performance.

KIOXIA-powered UFS Ver. 4.1 devices will bring big improvements to efficiency and performance for next-gen mobile devices with on-device AI.

Lagarto (SE) - Em junho deste ano, alunos do 6º ao 9º ano da Escola Municipal Paulo Rodrigues do Nascimento foram os primeiros a participar do projeto de extensão "Suporte Básico de Vida nas Escolas", ...

Microsoft's custom AI chip project, codenamed 'Braga,' faces a significant setback with a six-month delay into 2026 and performance expected to lag far behind NVIDIA's current Blackwell series ...

>Microsoft’s in-house AI chip efforts face hurdles I'm trying to visualize a chip, dressed in shorts and athletic shoes, jumping over hurdles.