AsianFin -- Following TSMC’s announcement ... gate-all-around (GAA) transistor architecture. PowerVia relocates power delivery to the backside of the chip, enhancing performance and enabling higher ...

San Francisco, 06 May 2025: Trilobio, which is building an automated robotic lab-in-a-box for biologists, today announced it has raised $8 million USD Seed investment. The oversubscribed round was led ...

Milpitas, Calif. – May 6, 2025 – Penguin Solutions (Nasdaq: PENG) today announced a strategic agreement with CDW, which will make the full portfolio of Penguin Solutions’ AI infrastructure offerings ...

KDDI and NEC outlined an ambition to create the largest cybersecurity business in Japan, a venture focused on developing domestic security infrastructure to protect companies and government agencies.

We sell different types of products and services to both investment professionals and individual investors. These products and services are usually sold through license agreements or subscriptions ...

TSMC's upcoming N3P technology is thought to feature. This is said to offer better efficiency and increased transistor density. More RAM is also thought to be in the offing. Analyst Jeff Pu has ...

The ODT-PVT-ULP-001C-7T is an ultra-low power temperature, voltage and process monitor designed in a 7nm CMOS process. This IP operates over the entir ...

So in many ways, thermal bottlenecks, not just transistor density, are now the ceiling of the Moore’s Law. And also the stakes are very enormous. We really wish to bring more thermal solutions by ...

One notable trend is the increasing development of 3nm and 2nm fabrication technologies, which are enabling chipsets with greater transistor density, lower power consumption, and enhanced thermal ...