Many of will have marveled at the feats of reverse engineering achieved by decapping integrated circuits and decoding their secrets by examining the raw silicon die. Few of us will have a go for ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine.

over heterogeneous wafer- and die-bonding technologies and eventually direct epitaxial growth in the longer term," states Joris Van Campenhout, fellow silicon photonics and director of the ...

IP can be packaged in different ways, including soft IP (software), hard IP (physical layout), and even as “chiplets,” individual silicon die that deliver the IP function. The revenue, according to ...