A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by Advanced Interconnect Technologies (AIT) meets today's OEM requirements of MSL Level 1, 260°C standards.

Strong demand, tight production capacity, and rising material costs have combined to slow the long downward pricing spiral of some of the most popular semiconductor packages. More stringent ...

Operating from 50-Hz to 7-MHz received frequencies, the MSRFIF RF-interface front-end IC runs at 5-kbps upconverting and 120-kbps downconverting data. Aspencore network. News & Analytics ... RF IC ...

At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI developments ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an … ...

Research into using glass substrates for chipmaking is nothing new. As Intel’s release says, the company has been working on this technology for at least a decade, as have other organizations ...

Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif., May 30 ...

China’s IC packaging and testing industry is more mature than its IC manufacturing and design sectors, reckons SEMI, though IC packaging and testing revenue growth has slowed in recent years.