Near-field mapping along the surface of an integrated circuit (IC) could reveal the radiated emission source inside by collecting the radiated electromagnetic field. In this article, the radiated ...

Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB ...

Meat giant Cranswick revealed its boss has seen his pay package swell by more than a third to £4.6 million as one of its farms remains at the centre of animal abuse claims. In its annual report, the ...

Iteration loops have been a vital aspect of EDA flows for decades. Ever since gate delays and wire delays became comparable, it became necessary to find out if the result of a given logic synthesis ...

Analog and mixed signal content is adding risk to ASIC designs. Pessimists see the problem getting worse, while optimists point to AI and chiplets for relief.

Siemens’ new Innovator3D IC™ solution suite enables IC designers to efficiently author, simulate and manage heterogeneously integrated 2.5D/3D IC designs. In addition, Siemens’ new Calibre 3DStress ...

The main controller IC on the primary PCB is an ARM-based MediaTek MT3689BCA Bluetooth SoC, which is also used in the Switch 2’s Joy-Cons.