The Display Driver IC Market grew from USD 4.07 billion in 2024 to USD 4.38 billion in 2025. It is expected to continue growing at a CAGR of 7.45%, reaching USD 6.28 billion by 2030.

However, a heterogeneous die introduces new challenges which include increased design complexity due to close interaction between the dies and package, supporting testability across assembly and ...

The new S6RTB-EHG RGB LED joins the 0.7-W S6RTB-THG device. Housed in a small package, the S6RTB-EHG features high-brightness red (typically 24 lumens [lm]), true green (typically 40 lm) and blue ...

Allegro MicroSystems had introduced 1MHz bandwidth current sensors that can measure hundreds of amps – the first fruit of its acquisition of Crocus Technologies. The technology is tunneling ...

TSMC’s advanced packaging capacity is fully booked until 2025 due to hyper demand for large, powerful chips from cloud service giants like Amazon AWS, Microsoft, Google, and Meta. Nvidia and AMD are ...

At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI developments ...

General components, especially converter applications like solar inverters, energy storage systems and EV charging piles, require temperature sensors like the digital SGM452, with its daisy-chain ...

Research into using glass substrates for chipmaking is nothing new. As Intel’s release says, the company has been working on this technology for at least a decade, as have other organizations ...

Melexis has launched the MLX91230, the first product of its third generation of current sensors – the MLX91230. The device brings 0.5% accuracy at an affordable price in a compact design. It ...

The heart of the circuit is based on IC HEX3653/GS1299/RDA7088. We can use any one of them. All three ICs have the same pinout and function and come in a SOP16 package with a 1.27mm lead pitch. You ...

Technologies highlighted at the symposium include: 3nm Portfolio: N3P, N3X, and N3AE – With 3nm technology now in volume production with the N3 process and the enhanced N3E version on the way in 2023, ...