Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and ...

In a report from DigiTimes, we're learning that Apple would adopt TSMC's new SoIC (System on Integrated Chip) advanced packaging technology that allows for 3D stacking of chips, providing improved ...

Simultaneously, the foundry's production capacity for 3D-stacked system-on-integrated chips (SoIC) packaging is set to undergo a significant boost, according to a report by Taiwan's .

When it comes to SoIC, TSMC expects monthly production capacity to reach 5000 to 6000 pieces by the end of the year, which is another 3x jump from the 2000 pieces made in 2023, and it's expected ...

SoIC Capacity Expected to Double TSMC plans to significantly expand its SoIC capacity. According to the report, the company’s monthly SoIC production was around 4,000–5,000 wafers in 2024. That figure ...