To meet this challenge, researchers at MIT have unveiled a promising new approach that could redefine how we build ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

Oreo Fans Are Calling Its New Limited-Edition Release a 'Game Changer' originally appeared on Parade. Oreo fans have ...

Continued innovation is helping to drive the development and growing adoption of wide bandgap materials, such as GaN.

TSMC has won an “almost unbeatable” position in the semiconductor industry, says Malcolm Penn (pictured)  CEO of  Future ...

Deal Semiconductor has started shipping its first silicon devices based on a new architecture called SuperQ with lower losses ...

The SiC MOSFETs benefit from improvements to the component structure, based on the original double-trench design. Therefore, it achieves up to 40% lower on-resistance with notably higher robustness ...

FTIR spectroscopy and digital twin simulations enhance thin-film deposition in semiconductor manufacturing, ensuring ...

Renesas launches the Gen IV Plus platform with three new high-voltage 650-V GaN FETs for AI data centers and server power ...

The global market for 12 Inch Wafer Foundry was valued at USD 115130 million in the year 2024 and is projected to reach a revised size of USD 265300 million by 2031, growing at a CAGR of 12.9% during ...

CVD silicon carbide components are widely used in etching equipment, including focusing rings, gas spray heads, trays, edge ...

In semiconductor equipment manufacturing, ceramic parts play a key role due to their high hardness, high insulation, corrosion resistance, and other characteristics. Among them, aluminum nitride ...