Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

Silanna Semiconductor has launched the FirePower series of laser driver ICs that significantly reduce the size and increase ...

Thermal resistance from junction to case (θJC) is a metric of how easily heat flows from the die junction to the exposed pad (note that while FET devices have channels rather than junctions, the term ...

Even more so because this deal includes the Sync Module 2 with the doorbell ... that you see them will convince them not to take the package. The video doorbell also works with Alexa.

Key technical outputs of the consultancy will include: (1) A training package for in-person delivery, comprising the training module, training agenda, and workshop materials (e.g. PowerPoint ...

Torex Semiconductor has created a nano-power dc-dc converter that can occupy only 7.7 x 3.1mm with all external capacitors – the necessary inductor is inside the device package. Called XCL108 and ...

Torex Semiconductor has created a nano-power dc-dc converter that can occupy only 7.7 x 3.1mm with all external capacitors – the necessary inductor is inside the device package. Called XCL108 and ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

We have been on a mission to bring secure, always-on connectivity across verticals. Request a consultation with our IoT connectivity experts to determine the best connected module package for your ...

Abstract: Over the glass transition temperature, epoxy molding compound strongly exhibits viscoelastic behavior which causes its Young's modulus to be not only temperature-dependent but also ...