Motorola designed its 16-pin PFP-16 power flat package for RF power amplifiers and similar components. You can attach and solder this surface-mount package to the pc board using the same standard ...

Texas Instruments has turned to 45nm RF CMOS process to squeeze a 60GHz radar, including antenna, into an 11 x 6.7mm package only 0.8mm tall. IWRL6432AOP is an FMCW radar that works over 57 to 63.9GHz ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, ...

The advanced packaging market for 5G RF FEM is projected to reach US $2.3 billion by 2026, representing a 30% compound annual growth rate (CAGR) according to Yole Développement (Yole), SA, an ...

Housed in a tiny 7 mm x 9 mm x 1 mm conformally coated package, the AX-SIP-SFEU occupies just 10 percent of the space of a PCB module-based solution, allowing it to be deployed in space ...

Mercury's DRF2580 System-On-Module Mercury's DRF2580 System-On-Module ANDOVER, Mass., Jan. 22, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company ...

RF Transmitter This simple RF transmitter, consisting of a 434MHz license-exempt Transmitter module and an encoder IC , was designed to remotely switch simple appliances on and off. The RF part ...

TriQuint Semiconductor has released three new gallium arsenide (GaAs) RF power amplifiers in a new package that serve on either side of a PCB board. The applications suitable for this device includes ...

We regard multichip module (MCM) BGA as an enabling technology that provides high-reliability, compact size, faster time to market and reduced costs for RF circuits. The use of chip capacitors and ...