The Quad Flat No Leads (QFN) package is expected to dominate the market, praised for its compact design and effective heat management, crucial for automotive and telecommunication sectors.

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Compulab MCM-iMX95 is yet another NXP i.MX 95 system-on-module (SoM), whose main selling point is being offered as a solder-down QFN package with SMD pads. The hexa-core Cortex-A55 Edge AI module ...

Vishay Intertechnology, Inc. has launched a new 150 V TrenchFET® Gen V n-channel power MOSFET in the PowerPAK® SO-8S (QFN 6×5) packaging to enhance efficiency and power density for telecommunications, ...

This paper focuses on the design and development of a low-cost QFN package that is based on wirebond interconnects. One of the design goals is to extend the frequency at which the package can be used ...

The potting material acts as a buffer between the component and the external environment, absorbing thermal and mechanical stresses that would otherwise be transmitted directly to the solder joints.

LED backlight unit (BLU) specialist Darwin Precisions has stepped up its deployment in the QFN leadframe sector, optimizing its photo etching and electrochemical capability, according to company ...