The global semiconductor seals market size was valued at US$0.9 billion in 2023 and is projected to reach US$1.5 billion by 2030, witnessing a market growth CAGR of 8.1% from 2024 to 2030, according ...

Discover how the EP-Replayer transforms etch process development by enabling precise recipe optimization, reducing wafer ...

Dr. Jung-Dae Kwon's research team at the Energy & Environmental Materials Research Division of the Korea Institute of ...

Scientists developed flexible optoelectronic device using low-temperature process with minimized thin-film defects via ...

Dr. Jung-Dae Kwon's research team at the Energy & Environmental Materials Research Division of the Korea Institute of Materials Science (KIMS, President Chul-Jin Choi) has successfully developed an ...

Etching is a fundamental step in semiconductor fabrication, involving the selective removal of material from the wafer ...

The hardness of silicon nitride ceramics is one of its core performance indicators, usually measured by Vickers hardness (HV) ...

ACM’s patent-pending nitrogen bubbling technique provides significant wet etching uniformity improvement and enhanced cleaning performance FREMONT, Calif., July 24, 2025 (GLOBE NEWSWIRE) -- ACM ...

Abstract: Atmospheric-pressure reactive thermal plasma jet (R-TPJ) with Ar and O 2 gas mixture was applied to etching of photoresist (PR) on silicon wafer. An optical interference contactless ...

We develop a specialized fabrication process combining deep reactive ion etching with diffusion-limited wet chemical etching, enabling precise control over both hole geometry and surface morphology.