Figure 5. Datapath planning and routing. Conclusion For more on the challenges and advantages of the exciting IC package technology and a fuller description of the seven best practices in IC package ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

OIF Approves IC-TROSA Implementation Agreement, Specifications Speed Delivery of a Higher Level of Integration for Transmit and Receive Optical Components ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

There are five components of physical fitness and each one will help you live a long, healthy life. Here's how to incorporate them into your run schedule.

System-in-package devices can consist of multiple active and passive components. To test every component individually, all of the pins of each component need to be brought out to a pin/ball on the ...

Conclusion Physical activity interventions that combine self-monitoring with other components provide an additional modest yet sustained increase in step count compared with self-monitoring alone.