SkyWater Technology SKYT shares are currently cheap, as suggested by the Value Score of B. In terms of forward 12-month price/sales (P/S), SKYT is trading at 1.4X, which is significantly lower ...

Image of temporary bonding process by light irradiation and easy removal of temporary bonding film by peeling off Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen ...

Wafer producers scramble to stay afloat despite hydropower advantage In a new weekly update for pv magazine, OPIS, a Dow Jones company, reports that FOB China wafer prices remained stable this ...

Chicago Cubs superfans Denise Vasquez and Cathy Weadly first bonded over spring training baseball in Arizona. But when Weadly found out that Vasquez needed a kidney transplant, she stepped up to ...

CHARLESTON, W.Va. — The state Public Service Commission has rejected a request by Appalachian Power Company to cancel a hearing set for next week’s on the utility’s proposal to securitize $2 ...

TOPEKA (KSNT) – Washburn men’s basketball is hosting its annual kids’ camp at the university’s recreation center this week. Children in grades two through eight are working to sharpen ...

SEALSQ, ColibriTD, and Xdigit Announce Plan to Develop a Breakthrough Quantum Computing Based Solution Set to Revolutionize Semiconductor Wafer Yields for Sub-7nm Nodes ...

In integrated circuit manufacturing, chemical mechanical polishing (CMP) is used to control the surface roughness of wafers and other substrates—a key factor influencing the reliability of final ...

Surface topography at the nanoscale is vital for material performance, impacting semiconductor processes and quality control through advanced AFM techniques.

Although wafer manufacturing in India is comparatively nascent as an industry, Premier Energies is one of a number of companies eyeing aggressive expansion plans in this part of the value chain.

LA CROSSE (WKBT) -- A local brewery is joining the fight against hunger by partnering with a community food pantry to raise funds for food recovery efforts.

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.