To close the cycle for plastic packaging as much as possible, 51 partners from industry, the research sector and civil society are working together in two innovation labs: KIOptiPack, which ...

Until QML Class P, there had been no standardized, radiation-hardened equivalent for plastic packaging. Transforming Space Electronics. With QML Class P parts, engineers can reduce the size of the ...

Festo's All About Robotic Grippers covers advanced solutions, misconceptions, all-in-one kits, and online engineering tools.

Amazon Echo, Kindle, and Fire TV products in new-look packaging that uses more recycled fiber and less ink. (Amazon Photo) Some boxes delivered by Amazon will have the same look on the inside as ...

Both of these tools represent key elements of Siemens’ Solido™ Simulation Suite software, which is an advanced portfolio of AI-accelerated simulators for intelligent IC design and verification, ...

The new APR Design® Guide Digital Tool puts everything at the designers’ fingertips in a new and intuitive platform enabling them to create packaging that meets their requirements, can be ...