Image transfer ... Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand ...

C&G Hi Tech, a semiconductor equipment corporation participating in the 'Semicon Korea 2025' exhibition, noted that its glass substrate prototypes ... board (Glass PCB) through glass vias.

We apply these developed procedures to glass fiber reinforced polymers ... sample was brushed with a thin layer of uncured epoxy and then transferred to a dried hBN monolayer on an aluminum substrate.

Glass fiber reinforced epoxy resin substrate with interdigitated electrodes of copper covered with nickel and gold (ENIG). The initial thickness of copper was 35 μm (prior to corrosion) on the PCB.

Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the recent AI trend.

Abstract: This study aimed to analyze the reliability of solder joints on different types of printed circuit board (PCB) substrates. Conventional glass-epoxy (FR-4) laminate and aluminum substrate ...

Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore's Law beyond 2030, ensuring continuous development without being constrained by process size ...

This integration makes your board pictures, top and bottom view, generated on every push into the repo – just embed two image links into your README.md. This integration is made possible thanks ...

To have a solid starting point for setting up material models, the moisture expansion of glass fiber reinforced epoxy ... on PCB base materials and PCBs on a purely experimental level. The optical ...