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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...
Stack memory with 36 GByte per chip: HBM4 mass production from October 2025
SK Hynix is on the home stretch for mass production of the blazing fast HBM4 stack memory for Nvidia's next generation Rubin ...