The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

“It’s not just 3D that’s happening. It’s smaller pitch sizes and smaller interconnects. When you look at the physics behind penetrating into a package and identifying different layers in that package, ...

IR’s new IRS2505L power factor correction boost IC comes in a 5-pin SOT23 package for switch mode power supply, LED drivers, and fluorescent and HID electronic ballast applications.

Part of the company's Silver Wings family, the new 9-GHz solderless socket systems reportedly can, with just 5 models, handle every BGA lead pitch, ball count and package size currently available.