Fig. 2: Stresses can be imparted throughout the 3D IC package assembly flow. Interpreting 3D IC stress results. After the initial 3D IC package definition and stress analysis, designers must interpret ...

“It’s not just 3D that’s happening. It’s smaller pitch sizes and smaller interconnects. When you look at the physics behind penetrating into a package and identifying different layers in that package, ...

First is the NeoGene Liquid Cooler which will be used for packaged IC heat dissipation at 1 U configuration. The second is the Direct-to-Silicon Cooling Package Module, which can be adopted by IC ...

IR’s new IRS2505L power factor correction boost IC comes in a 5-pin SOT23 package for switch mode power supply, LED drivers, and fluorescent and HID electronic ballast applications.