A critical breakpoint is the intersection of the package design activities and assumptions with those of the silicon design process. Leveraging both our experience in wire-bonded IC/package co-design ...

These physical design reuse circuits (PhRC) are native, first-class design objects that provide dynamic net propagation from the parent netlist, allow for rapid ECOs, and manage the golden source of ...

Add a series resistor to the LED current path. This will not change the total power dissipated in the design, but it will remove some of the Pd from the IC package to the external series resistor.

IC package design best practices. In order to efficiently design new types of IC packages, designers and design teams need to embrace a new emerging set of best practice design techniques, processes ...

This higher level of integration enables engineers to design concurrently across the chip, package and board. By automating what has until now been a manual process, the Virtuoso System Design ...

EPEPS -- Cadence Design Systems, Inc. , a leader in global electronic design innovation, today announced enhancements to its Allegro® 16.6 Package Designer and System-in-Package Layout solution ...

The design environment called Xpedition Package Integrator flow can be used to integrate existing IC, package and PCB design tools from Mentor and even third party tools. According to Mentor, the ...

After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services. MEYREUIL, France& SAN JOSE, Calif.---- Presto Engineering, an ASIC design and ...

Improving IC Package Inspection. July 1, 2001. Evaluation Engineering. ... To join the conversation, and become an exclusive member of Electronic Design, create an account today!