Calibre 3DStress from Siemens Digital delivers the early analysis and simulation of chip/package interactions at all stages ...

White also noted automotive designs where self-driving technology content is driving the need for 3D ICs. At the Design Automation Conference (DAC) held in San Francisco, California, on 22-25 June ...

The Innovator3D IC solution suite has been developed to enable IC designers to author, simulate and manage heterogeneously ...

Designers must have the tools and methodologies to simulate mechanical stresses throughout the 3D IC assembly, from early feasibility analysis to final design sign-off. Evaluating stress in 3D IC ...

Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence ® memory and interface IP solutions in Samsung ...

Why close collaboration between chip designers, package designers and manufacturers is required to accurately model and simulate the 3D package assembly in order to predict and mitigate stress-related ...

Estimated market potential for advanced packaging of more than EUR 69 billion by 2029; 2.5/3D, Flip Chip and ...

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...

Burgopak partnered with Winnove MED to create a protective packaging solution for their custom-made orthodontic retainers.

Silanna Semiconductor announced the release of the SL2002, the second breakthrough product in its FirePower family of laser ...