A critical breakpoint is the intersection of the package design activities and assumptions with those of the silicon design process. Leveraging both our experience in wire-bonded IC/package co-design ...

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...

These physical design reuse circuits (PhRC) are native, first-class design objects that provide dynamic net propagation from the parent netlist, allow for rapid ECOs, and manage the golden source of ...

IC package design best practices. In order to efficiently design new types of IC packages, designers and design teams need to embrace a new emerging set of best practice design techniques, processes ...

The design environment called Xpedition Package Integrator flow can be used to integrate existing IC, package and PCB design tools from Mentor and even third party tools. According to Mentor, the ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services. MEYREUIL, France& SAN JOSE, Calif.---- Presto Engineering, an ASIC design and ...

EPEPS -- Cadence Design Systems, Inc. , a leader in global electronic design innovation, today announced enhancements to its Allegro® 16.6 Package Designer and System-in-Package Layout solution ...

This higher level of integration enables engineers to design concurrently across the chip, package and board. By automating what has until now been a manual process, the Virtuoso System Design ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond ...