Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering ...

Taiwanese prosecutors have detained three individuals in connection with the alleged theft of trade secrets from TSMC.

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap ...

GlobalFoundries is one of the top five contract semiconductor manufacturers, or foundries. It focuses on specialty products that perform narrower sets of tasks compared with the most advanced ...

Apple’s iPhone 17 Pro is expected to roll off Foxconn’s production lines near Chennai just weeks from now and fly straight ...

Monolithically integrated GaN power ICs offer significant advantages over traditional silicon chips, including superior ...

Intel is still one of the biggest players in the CPU (and now GPU) segment, but it has struggled to keep up with the new times. As it turns out, it's struggling with yields for its newest technologies ...

Intel is reportedly still struggling with a chipmaking process crucial to its future. Reuters reports that the company's 18A ...

US chip giant Intel is struggling to perfect its crucial 18A chip manufacturing process, aimed at regaining market dominance ...

However, we believe Casio will leverage its singular position, especially in Asia, and expect solid and stable cash flow to continue. Casio has established a reputation for providing tough and ...

Wafer-scale InSe transistors with record electron mobility and low power use could power the next generation of AI chips.

Lighting innovation is keeping pace with automation, enabling vision systems to see faster, clearer and smarter. And as ...