ASE’s FOCoS-Bridge with TSV can fulfill next-generation AI and HPC performance demands through heterogenous integration for high-power and high-bandwidth systems.

Micron Technology Inc. is an $85 billion tech player that specializes in high-performance memory solutions such as high-bandwidth memory [HBM], and in LPDRAM technology, which is more AI data ...

3D X-DRAM technology will bring bigger, faster memory by ... NEO’s 3D X-DRAM stacks layers sky-high, ... NEO’s statements about eliminating the need for TSV and enabling up to 32K-bit bus ...

Report: 2027 iPhones Could Adopt Advanced AI Memory Technology. Wednesday May 14, 2025 4:35 am PDT by Tim Hardwick. ... they said it's high bandwidth, memory, not High Bandwidth Memory) ...

JEDEC has published the official HBM4 (High Bandwidth Memory 4) specification under JESD238, a new memory standard aimed at keeping up with the rapidly growing requirements of AI workloads, high ...

High Bandwidth Memory (HBM) stands as one of the crucial components driving AI performance. Through the adoption of the HBM4 JEDEC Standard, this technology promises to deliver even higher ...

Generative AI has sparked significant demand for Micron’s advanced memory products. Competitive pressures facilitate opportunities on both sides of Direxion’s MU-focused bull and bear funds ...

The memory-chip maker reports revenue of $9.3 billion for the fiscal third quarter on strong demand for its high-bandwidth memory chips Last Updated: June 25, 2025 at 9:08 p.m. ET First Published ...

Micron’s high-bandwidth memory (HBM) business stood out, with sales of $1.5 billion marking nearly 50% sequential growth, fueled by demand for AI computing applications.

SK Hynix's stock rose as much as 4.8% to 260,000 won, equivalent to $191.26, early Tuesday and changed hands at more than 250,000 won for most of the session, beating its previous record intraday ...

SUNNYVALE, Calif., May 28, 2025--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced Fan-Out Chip-on-Substrate ...