Latency in relation to processors and performance is how long it takes for information to travel from A to B. The longer it ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

Professor Kim Joung-ho of the Korea Advanced Institute of Science & Technology (KAIST), widely recognized as a leading expert in high-bandwidth memory (HBM) design, will present a 15-year roadmap for ...

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...

TAIPEI (Taiwan News) — Powertech Technology Inc said Wednesday that Taiwan dollar appreciation could dent earnings even as it ...

The company compares its 3D X-DRAM density to the current 0a-node planar DRAM’s 48GB and claims to reach 512GB, but the ...

Lam's leadership in gate-all-around, HBM, and advanced packaging supports above-consensus FY26 earnings. Read why upside catalysts are lacking for LRCX stock.

A model of SK hynix's high-bandwidth memory (HBM) technology is displayed during the World IT Show at COEX in Seoul, South Korea, Friday, April 25, 2025. (AP Photo/Ahn Young-joon) Hieun Shin with ...

In contrast, compatriot SK Hynix supplies advanced high bandwidth memory (HBM) chips to AI leader Nvidia. Investors expecting bigger deals involving Samsung's cash cow chip business might feel ...

PETALING JAYA: The positive momentum of global semiconductor sales, which posted another healthy growth in March, will continue to see strong demand from artificial intelligence, 5G and electric ...

Inside one of South Korea's oldest semiconductor research institutes, the cleanrooms and workshops are calm and immaculate, but outside the Seoul National University campus, a chip storm is brewing.