FormFactor reports that limitations with conventional cantilever probing solutions allow for only a few devices to be tested in parallel today. At higher levels of parallelism, these probing solutions ...

SEOUL — Korea's Hynix Semiconductor Inc. has demonstrated the ability to perform high-speed wafer-level testing of DRAM devices using a probe system from Teradyne Inc. and probe cards from FormFactor ...

Smiths Interconnect has introduced a production probe head for wafer-level packages and known good die. Part of its Volta range Volta 180 is a WLCSP test connector for chips with 180um pitch IO. The ...