Low-temperature, high-accuracy die-to-wafer (D2W) hybrid bonding is increasingly employed to enable high bandwidth, high performance, and low power consumption packaged devices [1]. It is crucial to ...

Finally, the various improvements in wafer processing and wafer alignment during bonding will be discussed, resulting in high yield hybrid bonding down to 400nm interconnect pitch for wafer-to-wafer ...

In this paper, the integration of plasma dicing within the collective die to wafer hybrid bonding process flow will be discussed. A layer to protect Cu pads on the die bonding interface has been ...