Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

The idea is you bolt the wafer probe card into the top of the machine, needles-down, then wheel the whole thing over to the ATE. The ATE head will have that pogo-tower already docked.

FormFactor reports that limitations with conventional cantilever probing solutions allow for only a few devices to be tested in parallel today. At higher levels of parallelism, these probing solutions ...

NORTH READING, Mass., March 31, 2025--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test ...

Different test strategies and methods at wafer probe and package test are needed to accommodate today�s burgeoning SIP technology. The consumerization of the electronics markets continues its ...