Increased tax credits for chipmakers would further incentivize domestic semiconductor production; CMS Laser is on standby to provide sophisticated silicon processing solutions powered by lasers ...

Fonon's Wafer Dicing System incorporates Fantom Width Laser Dicing technology (FWLD), an innovative next-generation method of splitting brittle materials without generating a visible seam.

New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate ...

The global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021. Global Wafer Dicing Saws Market 2017-2021, has been prepared based on an in-depth market analysis with ...

With the new 2024/25 semester just days away, there are more than just new students on Boise State University's campus. On Wednesday, BSU unveiled its new semiconductor machine, the first of its ...

Boise State University to unveil new semiconductor, first of its kind at a school The AIXTRON machine for semiconductors is a first of its kind to be at a university in the U.S.

Jenoptik has sold an emerging laser materials processing technology to fellow German company 3D-Micromac. The thermal laser separation technology, known as ‘TLS-Dicing’, can be used to separate ...

Laser Photonics and CMS Laser Optimize Semiconductor Manufacturing With High-Precision Laser Marking, Dicing, Scribing Provided by ACCESS Newswire Jul 8, 2025, 1:40:00 PM ...