Wafer dicing is a crucial step in the semiconductor industry, particularly with blade sawing leading to small PPM (Parts Per Million) of chip and crack defects. This issue is intensified in Wafer ...

In the semiconductor space, laser technology is increasingly utilized for tasks such as marking, dicing, and scribing.These solutions, integrating lasers spanning from ultraviolet to far-infrared ...

Semiconductor processing is notoriously challenging. It is one of the most intricate feats of modern engineering due to the extreme precision required and the hundreds of steps involved, such as ...

In a first, Australian scientists turned to quantum machine learning to model semiconductor design, outperforming classical approaches.

Samsung Electronics has secured a broad license to a portfolio of semiconductor patents originally developed by Intel, a move industry analysts view as both a defensive strategy against potential ...

Politics After gut-wrenching debate, Oregon House passes bill preventing regular guns from turning into ‘machine guns’ Updated: Jul. 01, 2025, 9:00 a.m ...

Texas Instruments plans to spend over $60 billion on semiconductor plants in the US, including two new factories in Sherman, Texas. The company's long-term capital spending plan remains unchanged ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. We offer state-of-the-art wafer preparation, including ...