The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...
We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...
When we first started The Next Platform a decade ago, there was not really much of a reason to cover the company’s datacenter ...
TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...
As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...
Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an ...
and dual-die (CoWoS-L). Though Ming-Chi Kuo in the article claims these designations seem to be for marketing reasons, Nvidia refers to them as "Ultra dual-die" and "Ultra single-die" versions.
During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...
Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) for at least the next year based on design ...
Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...
HTC Corp (宏達電), which supplies VIVE virtual-reality (VR) headsets, yesterday said that Google LLC has agreed to buy its extended reality (XR) intellectual property (IP) and acquire some of its ...