X-ray metrology, a nondestructive characterization technique, was used to evaluate the warpage induced in a silicon (Si) wafer on a substrate with a predefined warpage. Section topography (ST) images ...

During the manufacturing process of the wafer, in particular during temperature changes, because of the different properties of the deposited films, the wafer can buckle, which induces a change of ...

Emerging monolayer molecular crystals (MMCs) have become prosperous in recent decades due to their numerous advantages. First, downsizing the active layer thickness to monolayer in organic ...