Silicon Laboratories has been awarded a grant of $23 million under the Texas Semiconductor Innovation Fund (TSIF). The ...

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...

Intel has announced that its 18A process node is "ready" for third-party clients, with tape-out design finalizations set to begin in the first half of this ...

India's first chip fabrication unit, has begun. The company has invited bids to upgrade the existing 180nm fabrication line ...

One major concern is just how well the Galaxy S25, with its relatively small 4,000mAh, can compete with other phones at a ...

From reducing material waste to improving sustainability, artificial intelligence is driving a new era of smart, data-driven packaging solutions.

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

Heat-resistant sensing and computing chips made of silicon carbide could advance aircraft, electric and gas-powered vehicles, renewable energy, defense and space exploration—and University of Michigan ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

We expect Lam to focus on generating strong cash flow while prioritizing its R&D investments. We also expect it to remain moderately leveraged. As of June, Lam held a net cash position, with $5.8 ...

Las Vegas' new offensive coordinator wouldn’t be back in the NFL if he didn’t adapt as the sport has continued to evolve.