Silicon Laboratories has been awarded a grant of $23 million under the Texas Semiconductor Innovation Fund (TSIF). The ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and ...

The use of terahertz waves, which have shorter wavelengths and higher frequencies than radio waves, could enable faster data ...

India's first chip fabrication unit, has begun. The company has invited bids to upgrade the existing 180nm fabrication line ...

One major concern is just how well the Galaxy S25, with its relatively small 4,000mAh, can compete with other phones at a ...

Las Vegas' new offensive coordinator wouldn’t be back in the NFL if he didn’t adapt as the sport has continued to evolve.

Three new microcontrollers (MCUs) are joining STMicroelectronics’ STM32C0 series, giving designers more flexibility with ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

Heat-resistant sensing and computing chips made of silicon carbide could advance aircraft, electric and gas-powered vehicles, renewable energy, defense and space exploration—and University of Michigan ...

Apple has launched the iPhone 16e, featuring the powerful A18 chip, Apple-designed C1 modem, and Apple Intelligence™ for ...