Silicon Laboratories has been awarded a grant of $23 million under the Texas Semiconductor Innovation Fund (TSIF). The ...

India's first chip fabrication unit, has begun. The company has invited bids to upgrade the existing 180nm fabrication line ...

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...

Intel has announced that its 18A process node is "ready" for third-party clients, with tape-out design finalizations set to begin in the first half of this ...