AMD put out a release yesterday, justifiably crowing that one if its EPYC "Venice" processors was the first HPC product to ...

A leaker is detailing the new A20 chip, expected to be available with the iPhone 18. Here's why it will be another major ...

This APU is built on the Zen 4 and Zen 4c architecture. Zen 4c is the same as Zen 4 but is compressed to take less space on the CPU die, hence being able to fit more cores. A trade-off for the smaller ...

The first of these is an optical interposer called the Passage M1000, which the California biz expects to begin shipping later this summer, and targets XPUs — think GPU or AI accelerators — or ...

A breakthrough in next-generation semiconductor technology has been announced by Chinese researchers, with the creation of the world’s largest N-polar gallium nitride (GaN) wafer, at eight ...

“Let’s make one thing clear. I will die WITH cancer before I die FROM Cancer,” she stressed. “And that mentality I’ll be holding onto.” Thurston, who was the Bachelorette lead for ...

The chips boasted 5x the performance uplift over Hopper, which sounded great until you realized it needed twice the die count, a new 4-bit datatype, and 500 watts more power to do it. The reality was, ...

The new wafer fabrication facility in Arizona will ... produced using TSMC’s N3/N3E process and a platform controller die based on TSMC’s N6 process. Intel’s Nova Lake processors ...

The efficiency improvement for Geekbench multicore scores, turns out to be about the same at 10%: Performance per Watt is treated as the efficiency metric where CPU performance is given by the ...

MORRIS, Ind. — A laboratory analysis turned up nothing miraculous about red marks found on a Communion wafer at a Catholic church in Indiana. The discovery at St. Anthony of Padua Catholic ...

Connectivity standards such as UCIe enable seamless inter-die communication. Chiplets also support AI scale ... The primary interconnect will usually be PCIe between the CPU and its peripherals, ...